PVA TEPLA
WSPS
- Year
- N/A
- Operational
- Unknown
- Install
- Installed - Powered Off
- Location
- Taiwan
About this asset
Single Wafer Processing
Configuration
UMC remarketing equipment not include pump / chiller and Heat exchanger. Please inspect to confirm configuration and condition and missing or damaged parts. Manufacturer (Make):Munich Metrology Model:WSPS 3 M S Serial Number:61043-01-12-99 Wafer Size (inches):8 Install Type:Stand-Alone Install Date:2000.02.25 Date of Last PM:2025.07.25 The system not On-Line Off-Line Date:2026.02.11 Can't produce Wafers As-Is OEM Audit unavailable 3rd Party Audit unavailable All Cables are present Wafer Handler Handler Type:25 of Cassette Pre-Aligner Mini-Environment System SW (OS) version:Windows 6.1 Power Supply:220/110 V, 2.2 kW AC Dist Box:3ψ4W208-120V DIW:150kPa 20PSI, 1-2 I/h Gas:Nitrogen:150kPa 20PSI, 0.7m3 /h Power:220/110 V ,2.2kW Damaged parts:Mother board & Distribution board & Dryer
About PVA TEPLA WSPS
Wafer Surface Preparation System - Metrology Systems VPD WSPS system maps the entire VPD process chain in which the processes or modules in a compact system housing fitted with FFU units are supplemented by the corresponding infrastructure.
